Model: Logon TA2801

Thermal PASTE 23gr

Features 

• Thermal silicone compound (grease) for heatsinks
• Helps the heat dissipation from a CPU, chipset or processor to a heatsink
• Excellent thermal impedance
• Perfect stability - will not separate, run, migrate, or bleed
• Non capacitive or electrically conductive

Specifications

• 23g in bottle
• Thermal conductivity: > 4.63 W / mK
• Thermal Impedance <0.0087 ° C-in2 / W
• Weight loss after 96 hours @ 100°C: <0.15 %
• Permittivity @ 106 Hz: 2.4
• Volume Resistivity: 5.0 x 10E13 (Ohm*cm)
• Dielectric Strength: 2.5 KV/mm
• Operating Temperature: -30 ~ 280 ° C
• Density: > 3.15 g/ cm3
• Volatility: <0.15 % @100 ?
• The dielectric constant: > 2.4
• Dissipation Factor: <0.005
• Viscosity: 12500 Pa s
• Thixotropic index: 350 ± 10 1/10mm
• Composites: 15% silicone compounds
• Compounds: 35% of carbon
• The compounds of metal oxides: 50%