Model: Logon TA2806

Heatsink thermal paste grease, 1.5 g weight

Features

• Thermal compund (grease) for heatsinks
• Helps the heat dissipation from a CPU, chipset or processor to a heatsink
• Excellent thermal impedance
• Perfect stability - will not separate, run, migrate, or bleed
• Non capacitive or electrically conductive

Specifications

• Weight: 1.5 g
• Color: grey
• Thermal conductivity: > 4.5 W / mK
• Thermal Impedance <0.205 ° C-in2 / W
• Density: > 2.5
• Evaporation: <0.001 %
• Volatility: <0.005 %
• The dielectric constant: > 5.1
• Dissipation Factor: <0.005
• Viscosity: 76 CPS
• Thixotropic index: 310 ± 10 ° C
• Operating Temperature: -50 ~ 240 ° C
• Composites: 50% silicone compounds
• Compounds: 30% of carbon
• The compounds of metal oxides: 20%