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CPU COOLING THERMAL GREASE 1,5 GRAM
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Afficher les spécifications complètesMasquer les spécifications compl�esModel: Logon TA2806
Heatsink thermal paste grease, 1.5 g weight
Features
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
Specifications
- Weight: 1.5 g
- Color: grey
- Thermal conductivity: > 4.5 W / mK
- Thermal Impedance <0.205 ° C-in2 / W
- Density: > 2.5
- Evaporation: <0.001 %
- Volatility: <0.005 %
- The dielectric constant: > 5.1
- Dissipation Factor: <0.005
- Viscosity: 76 CPS
- Thixotropic index: 310 ± 10 ° C
- Operating Temperature: -50 ~ 240 ° C
- Composites: 50% silicone compounds
- Compounds: 30% of carbon
- The compounds of metal oxides: 20%
Nous sommes désolés ... Ce produit n'est plus disponible